Fodenn IPC-Q37MF Customized Embedded Industrial PC Motherboard

1.Intel® LGA1151 Socket Supports 9th and 8th Gen CoreTM Processor(Max 95W)
2.Intel® Coffee Lake-S Q370 Chip
3. Support 4*DDR4 2666/2400/2133MHz, up to 128GB Dram
4. Realtek ALC662VD Audio
5. 1*Intel®I219-VGiga LAN +1* Intel® i210AT Giga LAN
6. Support 6* SATA III (6Gb/s) & 2*M.2 (M key )
7. Support VGA/DVI-D/HDMI/DP /LVDS Output
8. 2* RS232/422/485 (COM1/2), 4*RS232
9. 4*USB3.2 and 2*USB3.0 and 5*USB2.0
10. 2 *PCI-E x16 and 2*PCI-Ex4 Slots
11. 1 *M.2 E key Support CNVi
12. ATX Power Input
13. Micro ATX Form Factor (244 *244 mm)

描述

ProcessorIntel®LGA1151 Socket Supports 9th and 8th Gen CoreTM Processor Max 95W
ChipsetIntel® Coffee Lake-S Q370 Chip
Memory4* LONG DIMM slot,DDR4 2666/2400/2133 MHz DRAM,up to 128GB
Display functionVGA+HDMI+LVDS+VDI-D+DP
Ethernet Intel®I219-V +i210AT Gigabit LAN,10/100/1000 Mbps,2*RJ45
Storage function6 * SATAIII (6.0Gb/s , Support RAID 0/1/5/10)
2 * M.2 Key M slot(1*2242/2280/22110 (NVMe ),1*2242 (SATA,Co-lay SATA4);1*M.2 B slot(3042/3052,Support 3G/4G/5G Module);1*M.2 E slot(2230,Support CNVi)
Expandable Port2*PCI-E x16 + 2*PCI-E x4 slots
1*SIM Card Holder
AudioRealtek ALC662VD,Line-Out, Line-in, MIC.
IO Port1*PS/2
2* USB3.0 +4* USB 2.0 + 1*USB2.0(Erect)
5 (COM2: RS232/422/485,COM3/4/5/6 :RS232,COM2/3/4/5 Support 5/12V TTL)
Dimensions 244 * 244mm
TemperatureWorking Temperature:0℃~60℃
Storage Temperature:-20°C ~ 85°C
Humidity10%~95%(Non-condensing state)