A flexible industrial motherboard designed to bring multi-generation Intel processing power and reliable I/O connectivity to space-conscious industrial systems.
As industrial computing applications continue to evolve, system manufacturers increasingly need computing platforms that can balance processing performance, connectivity, system size, and long-term product flexibility.
To address these requirements, FODENN has introduced a new 17×17cm industrial motherboard platform, expanding its range of compact embedded computing solutions for OEMs, system integrators, and industrial equipment manufacturers.
Measuring 170×170mm, the new motherboard provides a practical balance between compact system design and sufficient PCB space for industrial applications.
Compared with ultra-compact motherboard formats, the 17×17cm design provides additional room for hardware layout and system integration while remaining compact enough for many space-constrained industrial products.
This makes the platform particularly suitable for equipment where designers need to integrate computing, networking, and serial communication functions into a relatively small enclosure.
The motherboard integrates dual LAN and dual COM ports, providing connectivity options for industrial equipment that needs to communicate with multiple external devices and networks.
The combination of network and serial interfaces makes the platform suitable for applications such as:
For system designers, having multiple communication interfaces directly on the motherboard can help simplify system architecture and reduce the need for additional expansion hardware.
Another major feature of the new platform is its wide Intel CPU compatibility.
The motherboard supports a broad range of Intel processors, including:
This multi-generation compatibility allows customers to select a processor according to the performance, power consumption, cost, and lifecycle requirements of their specific application.
Rather than being limited to a single processor generation, system manufacturers can evaluate different CPU options while maintaining a familiar motherboard form factor.
Support for the latest Intel Wildcat Lake series CPUs extends the platform beyond legacy and established Intel processor solutions.
For customers developing new industrial products, this provides an opportunity to adopt newer Intel platforms while maintaining the compact 17×17cm motherboard concept.
The result is a flexible foundation for both current industrial equipment projects and next-generation embedded computing designs.
The new 17×17cm platform is not limited to standard applications.
FODENN works with OEM and ODM customers to develop customized industrial computing solutions based on specific hardware and application requirements.
Depending on the project, customization and development support can include:
This makes the 17×17cm platform suitable not only for standard industrial PCs, but also for purpose-built equipment and customized embedded systems.
The introduction of the new 17×17cm motherboard strengthens FODENN's portfolio of compact industrial computing platforms.
With multiple motherboard sizes and support for a wide range of Intel CPU generations, FODENN aims to provide customers with more choices when designing industrial PCs, embedded systems, automation equipment, and networked devices.
Looking for a compact Intel motherboard for your next industrial project? Contact FODENN to discuss your CPU, I/O, form factor, and customization requirements.
FODENN — Flexible Motherboard Solutions for Industrial Computing.
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