New compact industrial motherboard platform delivers flexible connectivity, wide CPU compatibility, and scalable solutions for industrial computing applications.
FODENN is pleased to announce the launch of its new 12×12cm industrial motherboard series, designed to meet the growing demand for compact, reliable, and highly flexible computing platforms in industrial and embedded applications.
With a compact 120×120mm form factor, the new motherboard series combines rich I/O connectivity with broad Intel CPU compatibility, making it an ideal platform for industrial PCs, automation equipment, digital signage, network appliances, POS systems, edge computing devices, and other embedded applications.
The new 12×12cm motherboard series is designed with industrial connectivity in mind, featuring:
The combination of dual LAN and dual COM ports provides greater flexibility for applications that require simultaneous network communication and serial device connectivity.
This makes the platform particularly suitable for industrial automation, communication gateways, control systems, kiosks, POS terminals, network equipment, and edge computing applications.
One of the key advantages of the new platform is its broad Intel CPU compatibility.
The motherboard series supports multiple generations of Intel processors, including:
By supporting processors across multiple generations, FODENN provides customers with greater flexibility when selecting the right balance of performance, power consumption, cost, and product lifecycle for their applications.
In addition to supporting established Intel platforms, the new motherboard series is also designed to support the latest Intel Wildcat Lake series CPUs, providing customers with a path toward newer-generation embedded computing solutions.
This broad platform strategy allows system integrators and OEM/ODM customers to develop different products around a consistent 12×12cm motherboard form factor, helping reduce redesign efforts and simplify product development.
With its compact size, flexible processor support, and industrial-oriented I/O configuration, the new motherboard series can be used across a wide range of applications, including:
The compact 120×120mm design also makes the platform suitable for applications where space efficiency and reliable computing performance are important requirements.
FODENN provides more than standard motherboard products. For customers with specific application requirements, we can also support OEM/ODM customization and platform-level development.
Depending on project requirements, customization may include hardware configuration, I/O interfaces, BIOS/firmware, branding, and other platform-related requirements.
Our engineering and manufacturing capabilities allow us to work with system integrators, distributors, and industrial equipment manufacturers to develop customized computing solutions based on their application needs.
The launch of this new 12×12cm motherboard series further expands FODENN's industrial motherboard portfolio and provides customers with a flexible platform covering both established Intel processors and the latest-generation Intel platforms.
Whether you are developing a new industrial computer, upgrading an existing platform, or looking for a compact motherboard for a customized embedded system, the new FODENN 12×12cm series provides a strong foundation for your next project.
For detailed specifications, CPU compatibility, customization options, or project requirements, please contact the FODENN team.
FODENN — Flexible Industrial Computing Solutions for Your Next Project.
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