Fodenn Receives 2019 Intel Technology Innovation Award
Under the current general trend of Internet of Everything, the market scale is gradually expanding, and industry standards are constantly improving. The development of the Internet of Things industry in mainland China is particularly rapid. In 2019, the market scale of the Internet of Things industry in Mainland China will exceed 1.5 trillion yuan. As a technology leader in the global Internet of Things, Intel provides new impetus for the Internet of Everything and continues to innovate and change the global artificial intelligence and Internet of Things technologies.
To promote communication across the entire ecosystem, Intel held the “2019 Intel Artificial Intelligence and Internet of Things Ecology Partner Summit” at Xiamen on October 16 to provide industry partners with an AIoT An excellent experience and communication platform in the field, a close-up understanding of the industry ’s cutting-edge technology directions, opportunities and hotspots in technology industrialization, the latest solutions and successful practice cases, and sharing the innovation experience of top experts.
Fodenn shares industry innovation awards with Hisense on the basis of industry-leading innovative products such as ETC portable card issuing
The product has a built-in inhaled multi-card card, automatic card issuer, binocular live face detection, based on INTEL SKYLAKE-6200U, supports EC, and has 10USB 8COM for comprehensive support for multiple peripheral device.
AI + IoT has entered a brand-new stage of deep integration development, and human-computer interaction and the interconnection of everything have become an inevitable trend in technology development and industrial applications. The AIoT industry is surging at an unprecedented scale and speed. In this huge wave of digitization, Fodenn keeps pace with the times, grows with its partners, meets the wave, and realizes a new upgrade of various industries.