Fodenn Electronics Won The 2021 INTEL Product Innovation Award
Fodenn Electronics-Product Innovation Award
Intelligent manufacturing and innovation, wonderful can be expected
The 14th Intel IoT Summit was held.
On October 12, 2021, the 14th Intel IoT Summit with the theme of “Insights, Wisdom and Everything” was held in Yinchuan. Several speakers from different fields of Intel’s Internet of Things Division also shared the unique environment of the Chinese market through a combination of live speeches and video connections, focusing on Intel’s industrial, retail, financial services, hotel and catering, education Excellent results in other fields.
Changfu Electronics won the “Product Innovation Award” .
As an excellent partner of Intel, Mr. Fengxiang Xiao, the founder of Changfu Electronics, was invited to attend this meeting and received the “Product Innovation Award” from Intel on behalf of the company.
Intelligent manufacturing and innovation, wonderful can be expected.
Ubiquitous computing, ubiquitous connections, infrastructure from the cloud to the edge, and artificial intelligence constitute the “four super technical forces” that are becoming the core of shaping the digital transformation of the industry. At present, Changfu Electronics will further deepen the cooperation with Intel, promote product innovation and upgrade, in order to better serve the society and the public.